Texas Instruments: 45-nm chip making process doubles output per wafer

Texas Instruments (TI) on June 12 unveiled details of a 45nm semiconductor manufacturing process that leverages a "wet" lithography process to double the number of chips produced on each silicon wafer, increase processing performance and reduce power consumption. Through the use of numerous proprietary techniques, TI will drive the capabilities of its multi-million transistor, System-on-Chip (SoC) processors to new levels, increasing performance by 30% while reducing power consumption 40%, according to the company.

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