TSMC and Partners Develop Key Feature for Sub 1nm Process Technology

Update 5/21/2020 8:45am PT: TSMC has reached out and asked to clarify that the findings by the researchers may not necessarily be used in commercial chip production. The statement reads as follows:

The article “Ultralow contact resistance between semimetal and monolayer semiconductors”, published in the journal Nature is an exciting finding for the application of 2D materials to semiconductors, but it does not necessarily mean that this research will be applied by TSMC in future technology nodes. TSMC provided support to the work described in this article performed by researchers from MIT and National Taiwan University, and it is an excellent example of our collaboration with global leading academic institutions. However, all TSMC technologies beyond the 3nm node are in the pathfinding or exploratory research stage at this time.”

Original Article:

Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.