Latest about 3nm
Apple rumored to kick off M5 chip production using TSMC performance-enhanced 3nm node
South Korean website claims that TSMC has started high-volume production of Apple's M5 processors using N3P fabrication process.
Samsung to cut foundry investment in half, to $3.5B, says report
Unlike industry peers, Samsung Foundry reportedly intends to cut down spending on contract chipmaking unit.
6.4-magnitude earthquake may have affected 20,000 TSMC wafers
More details about the impact of Taiwanese earthquake impact on TSMC emerge: up to 20,000 wafers could be affected.
TSMC's wafer pricing now $18,000 for a 3nm wafer
TSMC increases wafer pricing with each new node although transistor density increases slowdown, says analysis.
Alphawave develops 3nm UCIe chiplet IP for die-to-die connectivity
Alphawave brings up 3nm UCIe die-to-die IP for CoWoS system-in-packages.
TSMC may increase wafer pricing by 10% for 2025: Report
TSMC plans to hike wafer pricing for HPC customers by 10%, 3% - 4% for other clients, according to analysts.
Intel 3 '3nm-class' process technology is in high-volume production: Intel
Intel details its 3nm-class process technology: 18% higher performance than 4nm-class, 1.2V support.
AMD announces 3nm EPYC Turin with 192 cores and 384 threads — 5.4X faster than Intel Xeon in AI work, launches second half of 2024
AMD CEO Lisa Su announced at Computex 2024 that the company's next-gen EPYC Turin chips for the data center will launch in the second half of 2024.
