Latest about 3nm
Alphawave develops 3nm UCIe chiplet IP for die-to-die connectivity
Alphawave brings up 3nm UCIe die-to-die IP for CoWoS system-in-packages.
TSMC may increase wafer pricing by 10% for 2025: Report
TSMC plans to hike wafer pricing for HPC customers by 10%, 3% - 4% for other clients, according to analysts.
Intel 3 '3nm-class' process technology is in high-volume production: Intel
Intel details its 3nm-class process technology: 18% higher performance than 4nm-class, 1.2V support.
AMD announces 3nm EPYC Turin with 192 cores and 384 threads — 5.4X faster than Intel Xeon in AI work, launches second half of 2024
AMD CEO Lisa Su announced at Computex 2024 that the company's next-gen EPYC Turin chips for the data center will launch in the second half of 2024.
AMD to use Samsung's 3nm tech as it looks to dual-source future chips: report
AMD is reportedly interested to use Samsung's 3nm-class node with gate-all-around transistors.
Arm takes aim at client PCs with new 3nm compute subsystems, offering pieces of its IP to its customers for desktops, laptops, and tablets
Arm greatly simplifies development of Arm-based processors for client PCs with CSS packing Cortex-X925 CPU and Immortalis-G925 GPU core.
Huawei patent reveals 3nm-class process technology plans — China continues to move forward despite US sanctions
Huawei's self-aligned quadruple patterning patent covers both 3nm and 5nm process technologies, which would allow SMIC and China to create more advanced chips despite the ongoing U.S. sanctions.
TSMC's third generation N3P 3nm node to enter high volume manufacturing this year
TSMC will start mass producing chips on its N3P node this year as the N3E fabrication process ramps. This will be the third generation of "3nm" class nodes from the company.
