Samsung opens next-gen 3D DRAM research lab in the United States

Samsung office in San Jose, CA
(Image credit: Shutterstock)

Samsung is currently in the process of developing next-gen 3D DRAM on American soil, says The Korea Times, according to its own industry sources. The lab for this next-gen 3D DRAM development is based in Silicon Valley, operating under the "Device Solutions America" division, or DSA for short. 

Apparently, the goal of this lab is to develop an upgraded DRAM model that will allow Samsung to take leadership of the global 3D DRAM market— that's, again, according to Korea Times' reporting on the matter.

As the benefits of 3D cache on desktop CPUs have already demonstrated themselves, Samsung's comments on the improvements offered by 3D DRAM seem quite promising. Korea Times reports a Samsung comment made in October 2023, where they claimed that new structures for sub-10nm DRAM will allow for larger single-chip capacities that can exceed 100 gigabits.

In short, Samsung's work on 3D DRAM could very much be pushing the envelope forward in terms of memory capacity. 3D stacking in CPU manufacturing for increased L3 cache is already proven to work as a method of dramatically boosting capacity, and performance in that constrained workload. 

Christopher Harper
Contributing Writer

Christopher Harper has been a successful freelance tech writer specializing in PC hardware and gaming since 2015, and ghostwrote for various B2B clients in High School before that. Outside of work, Christopher is best known to friends and rivals as an active competitive player in various eSports (particularly fighting games and arena shooters) and a purveyor of music ranging from Jimi Hendrix to Killer Mike to the Sonic Adventure 2 soundtrack.