Micron has started shipping samples of its next-generation HBM4 memory to key customers, the company announced this week. The new memory assemblies for next-generation AI and HPC processors feature a 36 GB capacity and offer bandwidth of 2 TB/s.
Micron's HBM4 first samples are 12-High devices packing 36 GB of memory and featuring a 2048-bit wide interface as well as a data transfer rate of around 7.85 GT/s. The samples rely on 24GB DRAM devices made on the company's 1ß (1-beta) DRAM process technology as well as logic base dies produced by TSMC using its 12FFC+ (2nm-class) or N5 (5nm-class) logic process technology.
"Micron HBM4's performance, higher bandwidth and industry-leading power efficiency are a testament to our memory technology and product leadership," said Raj Narasimhan, senior vice president and general manager of Micron’s Cloud Memory Business Unit. "Building on the remarkable milestones achieved with our HBM3E deployment, we continue to drive innovation with HBM4 and our robust portfolio of AI memory and storage solutions. Our HBM4 production milestones are aligned with our customers’ next-generation AI platform readiness to ensure seamless integration and volume ramp."
