HBM4
Latest about HBM4
![AMD](https://cdn.mos.cms.futurecdn.net/CxSPjnggWbijozZTnGSvgh-320-80.png)
Preliminary HBM4 specs point to major performance uplift for GPUs
By Anton Shilov published
JEDEC publishes initial specifications for HBM4: up to 1.64 TB/s per stack, loads of configurations.
![Samsung SAINT info](https://cdn.mos.cms.futurecdn.net/jjNZ3ye3aTL4odrMndAc4d-320-80.png)
Revolutionary Samsung tech that enables stacking HBM on CPU or GPU arrives this year
By Anton Shilov published
Samsung paves the way for HBM4 integration with its SAINT-D interconnection and packaging technology.
![AMD](https://cdn.mos.cms.futurecdn.net/CxSPjnggWbijozZTnGSvgh-320-80.png)
TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodes
By Anton Shilov published
TSMC to use 12FFC+ and N5 process technologies to build base dies for HBM4.
![SK hynix](https://cdn.mos.cms.futurecdn.net/NFsR7zzEc8asPnVCkk2HuY-320-80.png)
SK hynix confirms it will bring next-gen HBM manufacturing to the US — $3.87 billion memory fab to be built in Indiana
By Anton Shilov published
SK hynix selects Indiana for its first HBM packaging fab in the USA.
![SK hynix](https://cdn.mos.cms.futurecdn.net/NFsR7zzEc8asPnVCkk2HuY-320-80.png)
SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana
By Anton Shilov published
Indiana chips and Indiana nights, starting in 2028.
![XMC](https://cdn.mos.cms.futurecdn.net/bZWaX5JszuErZeRgH4ULjY-320-80.jpg)
Chinese foundry XMC aims to produce HBM memory
By Anton Shilov published
Yangtze Memory may jump into the HBM memory business via its XMC foundry unit.
![AMD](https://cdn.mos.cms.futurecdn.net/CxSPjnggWbijozZTnGSvgh-320-80.png)
TSMC and SK Hynix team up for HBM4 co-production: Report
By Anton Shilov published
TSMC and SK Hynix reportedly join forces to build products for AI, including HBM4 memory.
![AMD](https://cdn.mos.cms.futurecdn.net/CxSPjnggWbijozZTnGSvgh-320-80.png)
SK Hynix says new high bandwidth memory for GPUs on track for 2024 - HBM4 with 2048-bit interface and 1.5TB/s per stack is on the way
By Anton Shilov published
HBM4 memory with a 2048-bit interface on track for production in 2026.
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