HBM4
Latest about HBM4

SK hynix posts record revenues and profits amid surge of HBM demand
By Anton Shilov published
Sales of AI memory solutions, including HBM3 and eSSDs, drove SK hynix's revenues and profits to record levels.

Micron invests $7 billion in HBM assembly facility amid AI boom
By Anton Shilov published
Micron to expand HBM3E and HBM4 output when its HBM assembly facility in Singapore start operations in 2026.

Nvidia asked SK hynix to accelerate HBM4 chip delivery by six months, says report
By Anton Shilov published
SK hynix to deliver HBM4 memory to Nvidia about half of a year ahead of planned schedule.

Rambus announces HBM4 memory controller for AI GPUs
By Anton Shilov published
Rambus's HBM4 controller has a lot of performance headroom, but will it ever be used?

Samsung to tape out first HBM4 devices later this year, sampling begins in 2025: Report
By Anton Shilov published
Samsung's HBM4 details leak: 10nm for DRAMs and 4nm for base dies.

SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S.
By Anton Shilov published
SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S.

Preliminary HBM4 specs point to major performance uplift for GPUs
By Anton Shilov published
JEDEC publishes initial specifications for HBM4: up to 1.64 TB/s per stack, loads of configurations.

Revolutionary Samsung tech that enables stacking HBM on CPU or GPU arrives this year
By Anton Shilov published
Samsung paves the way for HBM4 integration with its SAINT-D interconnection and packaging technology.
Stay On the Cutting Edge: Get the Tom's Hardware Newsletter
Get Tom's Hardware's best news and in-depth reviews, straight to your inbox.