Latest about HBM4
Premium Samsung detailed a three-phase HBM roadmap at Hot Chips 2026 that progressively moves logic into the base die and ultimately stacks DRAM directly on the processor.
The increases will take effect on Grace Blackwell and Vera Rubin systems shipping early next year.
SPHBM4 promises HBM4-class bandwidth without usage of silicon interposer and CoWoS-like packaging.
Nvidia and SK hynix tighten their relationship.
The Samsung workers union could potentially cripple the company's production if management refuses to meet their demands.
Samsung to remain primary HBM memory supplier for AMD's AI accelerators as the companies look into possible foundry relationship.
The HBM4 36GB 12H stack runs at over 11 Gb/s pin speeds, delivering bandwidth greater than 2.8 TB/s.
Intel demonstrates 8X reticle size prototype system-in-package that features four logic tiles, two I/O tiles, and 12 HBM4-class stacks.
