HBM4

Latest about HBM4

Micron's HBM4
Micron starts to ship samples of HBM4 memory to clients — 36 GB capacity and bandwidth of 2 TB/s

By Anton Shilov Published

Micron has become the first DRAM vendor to begin sampling 36GB HBM4 memory with a 2048-bit interface and 2TB/s bandwidth.

DRAM
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Samsung to adopt hybrid bonding for HBM4 memory

By Anton Shilov Published

News Analysis Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.

News Analysis
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JEDEC finalizes HBM4 memory standard with major bandwidth and efficiency upgrades

By Kunal Khullar Published

HBM4 offers faster data rates, more channels, and higher memory capacities, with features like Directed Refresh and flexible voltage options to boost performance and reliability.

RAM
Micron
Micron unveils DDR5-9200 memory: 1γ process technology with EUV

By Anton Shilov Published

Micron's 1γ fabrication technology with EUV, new HKMG, and BEOL promises to increase performance while cutting power consumption for DRAM.

DRAM
SanDisk's HBF memory concept
SanDisk's new HBF memory enables 4TB of VRAM on GPUs

By Anton Shilov Published

SanDisk talks high bandwidth flash memory that promises to wed HBM bandwidth with 3D NAND capacity.

DRAM
SK Hynix
SK hynix posts record revenues and profits amid surge of HBM demand

By Anton Shilov Published

Sales of AI memory solutions, including HBM3 and eSSDs, drove SK hynix's revenues and profits to record levels.

DRAM
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Micron invests $7 billion in HBM assembly facility amid AI boom

By Anton Shilov Published

Micron to expand HBM3E and HBM4 output when its HBM assembly facility in Singapore start operations in 2026.

DRAM
TSMC CoWoS
TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks

By Anton Shilov Published

TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.

Tech Industry
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Nvidia asked SK hynix to accelerate HBM4 chip delivery by six months, says report

By Anton Shilov Published

SK hynix to deliver HBM4 memory to Nvidia about half of a year ahead of planned schedule.

GPUs
A CXL-based memory expander by SK Hynix.
Samsung and SK hynix double down on HBM4 and CXL technologies to counter Chinese competition

By Kunal Khullar Published

Samsung showcased its advances in CXL technology at the recent Open Compute Project Global Summit, while SK hynix plans to start mass production of HBM4 in the second half of 2025.

Tech Industry
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