Latest about HBM4
TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodes
TSMC to use 12FFC+ and N5 process technologies to build base dies for HBM4.
SK hynix confirms it will bring next-gen HBM manufacturing to the US — $3.87 billion memory fab to be built in Indiana
SK hynix selects Indiana for its first HBM packaging fab in the USA.
SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana
Indiana chips and Indiana nights, starting in 2028.
Chinese foundry XMC aims to produce HBM memory
Yangtze Memory may jump into the HBM memory business via its XMC foundry unit.
TSMC and SK Hynix team up for HBM4 co-production: Report
TSMC and SK Hynix reportedly join forces to build products for AI, including HBM4 memory.
SK Hynix says new high bandwidth memory for GPUs on track for 2024 - HBM4 with 2048-bit interface and 1.5TB/s per stack is on the way
HBM4 memory with a 2048-bit interface on track for production in 2026.
China's CXMT reportedly aims to make HBM memory for AI chips
CXMT to compete against Micron, Samsung, and SK Hynix for lucrative HBM memory market, says report.
