Latest about HBM4
SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S.
SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S.
Preliminary HBM4 specs point to major performance uplift for GPUs
JEDEC publishes initial specifications for HBM4: up to 1.64 TB/s per stack, loads of configurations.
Revolutionary Samsung tech that enables stacking HBM on CPU or GPU arrives this year
Samsung paves the way for HBM4 integration with its SAINT-D interconnection and packaging technology.
TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodes
TSMC to use 12FFC+ and N5 process technologies to build base dies for HBM4.
SK hynix confirms it will bring next-gen HBM manufacturing to the US — $3.87 billion memory fab to be built in Indiana
SK hynix selects Indiana for its first HBM packaging fab in the USA.
SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana
Indiana chips and Indiana nights, starting in 2028.
Chinese foundry XMC aims to produce HBM memory
Yangtze Memory may jump into the HBM memory business via its XMC foundry unit.
TSMC and SK Hynix team up for HBM4 co-production: Report
TSMC and SK Hynix reportedly join forces to build products for AI, including HBM4 memory.