Latest about HBM4
JEDEC finalizes HBM4 memory standard with major bandwidth and efficiency upgrades
HBM4 offers faster data rates, more channels, and higher memory capacities, with features like Directed Refresh and flexible voltage options to boost performance and reliability.
Micron unveils DDR5-9200 memory: 1γ process technology with EUV
Micron's 1γ fabrication technology with EUV, new HKMG, and BEOL promises to increase performance while cutting power consumption for DRAM.
SanDisk's new HBF memory enables 4TB of VRAM on GPUs
SanDisk talks high bandwidth flash memory that promises to wed HBM bandwidth with 3D NAND capacity.
SK hynix posts record revenues and profits amid surge of HBM demand
Sales of AI memory solutions, including HBM3 and eSSDs, drove SK hynix's revenues and profits to record levels.
Micron invests $7 billion in HBM assembly facility amid AI boom
Micron to expand HBM3E and HBM4 output when its HBM assembly facility in Singapore start operations in 2026.
TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
Nvidia asked SK hynix to accelerate HBM4 chip delivery by six months, says report
SK hynix to deliver HBM4 memory to Nvidia about half of a year ahead of planned schedule.
Samsung and SK hynix double down on HBM4 and CXL technologies to counter Chinese competition
Samsung showcased its advances in CXL technology at the recent Open Compute Project Global Summit, while SK hynix plans to start mass production of HBM4 in the second half of 2025.
