Latest about HBM4
Rambus announces HBM4 memory controller for AI GPUs
Rambus's HBM4 controller has a lot of performance headroom, but will it ever be used?
Samsung to tape out first HBM4 devices later this year, sampling begins in 2025: Report
Samsung's HBM4 details leak: 10nm for DRAMs and 4nm for base dies.
SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S.
SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S.
Preliminary HBM4 specs point to major performance uplift for GPUs
JEDEC publishes initial specifications for HBM4: up to 1.64 TB/s per stack, loads of configurations.
Revolutionary Samsung tech that enables stacking HBM on CPU or GPU arrives this year
Samsung paves the way for HBM4 integration with its SAINT-D interconnection and packaging technology.
TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodes
TSMC to use 12FFC+ and N5 process technologies to build base dies for HBM4.
SK hynix confirms it will bring next-gen HBM manufacturing to the US — $3.87 billion memory fab to be built in Indiana
SK hynix selects Indiana for its first HBM packaging fab in the USA.
SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana
Indiana chips and Indiana nights, starting in 2028.
