Latest about HBM4
TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
Nvidia asked SK hynix to accelerate HBM4 chip delivery by six months, says report
SK hynix to deliver HBM4 memory to Nvidia about half of a year ahead of planned schedule.
Samsung and SK hynix double down on HBM4 and CXL technologies to counter Chinese competition
Samsung showcased its advances in CXL technology at the recent Open Compute Project Global Summit, while SK hynix plans to start mass production of HBM4 in the second half of 2025.
Rambus announces HBM4 memory controller for AI GPUs
Rambus's HBM4 controller has a lot of performance headroom, but will it ever be used?
Samsung to tape out first HBM4 devices later this year, sampling begins in 2025: Report
Samsung's HBM4 details leak: 10nm for DRAMs and 4nm for base dies.
SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S.
SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S.
Preliminary HBM4 specs point to major performance uplift for GPUs
JEDEC publishes initial specifications for HBM4: up to 1.64 TB/s per stack, loads of configurations.
Revolutionary Samsung tech that enables stacking HBM on CPU or GPU arrives this year
Samsung paves the way for HBM4 integration with its SAINT-D interconnection and packaging technology.