Intel's budget Core Ultra 200 series chips have smaller heat spreaders than higher-end models

The Core Ultra 5 225 CPU.
(Image credit: Taobao)

The first images of Intel’s incoming budget Arrow Lake CPUs have leaked, and surprisingly, they sport an integrated heat spreader (IHS) smaller than the one used for other Core Ultra 200 Series chips (via @harukaze5719 on X).

The pictures come from the Chinese e-commerce site Taobao, where a merchant has listed the Core Ultra 5 245 and Core Ultra 5 225 for sale before Intel officially launches them. The same merchant is also selling the Core Ultra 7 265 and Core Ultra 9 285. At least in China, the launch of new Core Ultra 200 models is close at hand, and that’s made clear not only because listings are cropping up on Taobao but also since Intel’s China branch has already opened up preorders for many non-K Core Ultra 5 and 7 SKUs.

The Taobao listings wouldn’t be particularly interesting if it weren’t because the IHS used for the 245 and 225 is noticeably smaller than the one used for the 285, 265, and the unlocked CPUs that Intel launched in October. Specifically, the elevated portion of the smaller IHS, which is the part that makes contact with the CPU cooler, has been slightly shrunk, especially at the top of the chip. The rim, which goes under the CPU bracket on the motherboard, has gotten bigger, and it seems that the overall surface area of the smaller IHS is about the same as that of the original IHS.

The Taobao listings also came with CPU-Z screenshots, and assuming they’re accurate, they show that the 245 and 225 have the same family, model, and stepping identification as the 285.

Intel has traditionally used a mix of larger and smaller dies, and even architectures, for its Core 5 series, while Core 3 uses a smaller die and a previous-gen architecture. The smaller IHS could indicate the company has decided to use a smaller heatspreader for models with a smaller die. We've pinged Intel to see if the company will share further details.

Matthew Connatser

Matthew Connatser is a freelancing writer for Tom's Hardware US. He writes articles about CPUs, GPUs, SSDs, and computers in general.

  • hotaru251
    ....to what? save a a dollar of material cost? while spending god knows how much on machinery to make it smaller :|
    Reply
  • Notton
    My guess, the smaller IHS provides a better contact patch over the hot spots.

    If anyone remembers how the Intel IHS for 12-14th gen was utterly garbage. It warped in the socket due to the retention mechanism, and even if you modified the retention mechanism it still had a slight concave patch over the hot spot and resulted in poor contact with a heatsink.
    Noctua even went as far as offering an Intel specific convex contact plate.
    Reply