AI chip boom sparks BT substrate materials shortage — TSMC's huge demand causes supply disruptions for NAND flash controllers, SSDs

Generic silicon wafer for Samsung 3D NAND v9 story
(Image credit: Shutterstock)

TSMC's demand for CoWoS chipmaking materials has become so great that it is causing material shortages in the memory market. Mitsubishi Gas Chemical has announced to clients that shipments of raw materials for the production of BT substrate will be heavily delayed due to low supply.

As the largest supplier of BT substrate raw materials in the world, MGC's delays will trigger potential long-term shortages in the substrate supply chain, exacerbating existing issues and cost hikes in the memory production segment, particularly NAND flash controllers. Suppliers with existing NAND controller stock, such as Phison, are expected to win big in the ensuing months.

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Sunny Grimm
Contributing Writer

Sunny Grimm is a contributing writer for Tom's Hardware. He has been building and breaking computers since 2017, serving as the resident youngster at Tom's. From APUs to RGB, Sunny has a handle on all the latest tech news.

  • Notton
    If you are wondering what BT and ABF substrates are, like I was.
    BT: Bismaleimide-Triazine, an epoxy resin
    ABF: Ajinomoto Build-Up Film, a dielectric material

    BT patent expired in 1995, but was invented by MGC.
    Reply
  • joeer77
    Notton said:
    If you are wondering what BT and ABF substrates are, like I was.
    BT: Bismaleimide-Triazine, an epoxy resin
    ABF: Ajinomoto Build-Up Film, a dielectric material

    BT patent expired in 1995, but was invented by MGC.
    Thanks. I was wondering. Horribly written article.
    Reply
  • S58_is_the_goat
    Thanks Jensen... jerk
    Reply
  • usertests
    Good problem to have. Someone will make a lot of money.
    Reply