The U.S. is building a chip packaging supply chain in Latin America

JCET Group
(Image credit: JCET Group)
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To reduce dependency on Asia and package American chips in the Americas, the U.S. government has launched an initiative to boost chip packaging capabilities in Latin America. Notably, Intel already has an assembly, testing, and packaging facility in San Jose, Costa Rica. Yet, it is unclear whether the blue giant will benefit from the new initiative.

Meanwhile, the statement on the initiative's website stresses enhancing semiconductor manufacturing and securing supply chains; the initiative aims to prevent any single country or region from monopolizing the crucial chip packaging sector, which is vital to avoid potential manipulation or disruption of these essential services.

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Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.

  • why_wolf
    They really need to promote the sub components too, transistors, resistors, etc. Virtually all of that comes out of SE Asia and without that .01 part your $600 CPU is worthless.
    Reply