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VIDEO: Qualcomm Tests S4's Thermal Efficiency with Butter

Snapdragon's S4 SoC is a powerful piece of technology. However, while most of the S4 focuses on the chip's 28nm process or its future powering Windows 8 devices, Qualcomm is out to show off a different aspect of the SoC with its latest video proving the thermal efficiency of the S4.

To demonstrate how its product stands up against rival solutions, the company took three phones, one based on the Snapdragon S4 and two more mystery devices labeled only as 'Competitor A' and 'Competitor B.' Using a thermal camera to measure the thermal footprint that the three phones leave during peak performance, Qualcomm displayed the results on the following heatmap:

 

Still, why look at a heatmap when you can perform a similar test using butter? Its heatmap demonstration complete, Qualcomm placed big chunks of butter on each device. You don't need to be a scientist to figure out what happened next.

"Butter melts at 35 degrees Celsius," said Qualcomm's Vidyasagar Rao, later adding that the phone heating up the most was hitting 55 degrees Celsius. Yikes. Check the video to see the buttery action for yourself. [Ed. note: Now all we need to do is conduct the same test to pop some popcorn!]

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  • Murissokah
    So it won't make me a sandwich?
    Reply
  • mindless728
    omg that was hilarious and awesome at the same time
    Reply
  • mt2e
    A and B could be from 2 years ago for all we know......gesh talk about scewed
    Reply
  • mt2e
    skewed!
    Reply
  • tartarsause
    From my knowledge of smartphones, competitor B is the Galaxy S2 and competitor A the Motorola Razr but from personal experience the Razr gets much worse at its Kevlar back in terms of heat than the S2.
    Reply
  • s3anister
    Delicious.
    Reply
  • kikireeki
    Snapdrogon might be cooler, but it is slower as well.
    Reply
  • house70
    kikireekiSnapdrogon might be cooler, but it is slower as well.Recent OneX tests beg to differ.
    Reply
  • nforce4max
    Competitor A == Motorola Razr (powered by TI OMAP)

    Competitor B == Samsung Galaxy S2 (Powered by Exynos)
    Reply
  • 830hobbes
    Cool marketing but this doesn't control for the thickness of the phone backing, the material the backing is made of or the distance between the chip and the backing. All of these things can make a huge difference in heat transfer.
    Reply