Micron Unveils 1β (1-beta) DRAM Process Node, LPDDR5X-8500 Memory

Micron
(Image credit: Micron)

Micron on Tuesday announced its next generation 1β (1-beta) fabrication technology for DRAM (dynamic random access memory). The new node will enable Micron to cut down costs of its DRAM while also increasing their power efficiency and performance. 1β (1-beta) will be the company's last DRAM production process that will rely on deep ultraviolet (DUV) lithography and will not use extreme ultraviolet (EUV) tools.

Micron's 1β fabrication process uses the company's 2nd generation high-K metal gate (HKMG) and is said to increase bit density of a 16Gb memory die by 35% as well as to improve power efficiency by 15% when compared to a similar DRAM device made on the company's 1α node. The new manufacturing technology will be particularly useful for high-capacity DDR5 and LPDDR5X chips for mobile, server, and desktop applications. 

Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.