Synopsys Enables 5nm SoCs with HBM3

AMD
(Image credit: AMD)

Synopsys this week unveiled its HBM3 solution that enables developers of system-on-chips (SoCs) to add support for next-generation HBM3 memory to 2.5D designs implemented using a 5nm fabrication process. The IP package supports HBM3 memory chips featuring an up to 64GB capacity, up to 7200 MT/s data transfer rate, and up to 921 GB/s bandwidth.

Leading memory makers Micron, Samsung, and SK Hynix have endorsed Synopsys' industry's first complete HBM3 solution and said they were committed to produce HBM3 memory. Synopsys' HBM3 solution includes a DesignWare HBM3 controller, physical interface (PHY), verification IP, and 3DIC compiler.

Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.