With its technology partner Infineon Technologies maintaining a positive DDR2 outlook, Winbond Electronics has revised its 2006 monthly 12" capacity expansion plans upward by 4,000 12" wafers, with all the extra capacity set to be assigned to DDR2 production for Infineon, according to Winbond chairman Arthur Chiao at yesterday's loan signing ceremony.
Under the original schedule, Winbond expected to use the newly secured loan to finance its capacity expansion to 16,000 12" equivalent by the end of 2006 and 24,000 by the end of 2007.
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