Tesla reportedly taps TSMC to produce new CPU for autonomous driving — 3nm next-gen CPU may feature N3P process node

Tesla
(Image credit: Tesla)

Tesla is set to use TSMC's N3P (performance-enhanced 3nm-class) fabrication process to build one of its next-generation Full Self-Driving (FSD) hardware, according to a rumor published by China Times and noticed by analyst Dan Nystedt. If the information is accurate, Tesla plans to use a non-automotive grade production node for its FSD system-on-chip (SoC) or system-in-package (SiP).

TSMC's N3P process is a cutting-edge manufacturing technology that offers high performance, high transistor density, and relatively lower power. For demanding processors, such as Tesla's FSD hardware, N3P could be just what the doctor ordered. Several companies are reportedly committed to using production nodes, so Tesla will not be alone. But there is a catch about N3P and FSD chips: when exactly does Tesla plan to use this technology?

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Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.

  • kjfatl
    Using a non automotive node is a viable option. For cold environments, the obvious solution is to provide a heater that keeps the computer at the minimum safe operating temperature. If it is -40C outside, a small amount of power can be used to keep the computer warm. Worst case, if the system was in cold shutdown at -40C, would be a warmup time in the 5 minute range before FSD was available. It probably takes longer for the heaters on the cameras to defrost the lens covers.
    On the high end, various cooling approaches can be use to keep the chip cooled.
    Automotive grade parts are needed in an open engine compartment or tail light assembly, but not for the FSD computer.
    Reply