Asus Reveals Maximus VI Formula LGA1150 Motherboard

Asus has revealed its ROG Maximus VI Formula motherboard at Computex 2013. Its design is actually quite different from its predecessor because of the ROG Armor that Asus has placed over the motherboard. This armor is made of strong SECC steel and uses thermal pads to cool the relevant parts underneath. The most notable feature of this armor, though, is the CrossChill feature. CrossChill is a watercooling feature that allows users to connect their water cooling loops to the part of the armor that cools the VRMs.

The motherboard is based on the Z87 chipset, and thus features an LGA 1150 socket for Intel's 4th generation of core processors. The board will also feature four DDR3 memory slots, three PCIe 3.0 x16 slots, and three PCIe x1 slots. The board also carries a total of ten SATA ports, and even though no word was given, six of these are likely controlled by the Z87 chipset and four by a third party controller.

Another notable feature of the motherboard itself is the SupremeFX-audiochip. The SupremeFX-audiochip takes care of sound using a 600 ohm headphone amplifier. In combination with its other parts, it features an SNR (Signal-to-Noise Ratio) of an impressive 120 dBA. Another feature that will be found on all ROG boards is the wireless 802.11ac and Bluetooth 4.0 connectivity.

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  • esco_sid
    I have the gene 5 from them and the soundcard is just upgraded realtek one its just a marketing gimmick in my opinion i upgraded it to soundblaster z and theres miles of difference.
  • vmem
    Between the thermal armor and the upgraded realtek sound, the whole thing looks like a marketing gimmick...
  • lp231
    So what's the difference between this ROG armor vs the armor on the TUF?
    Still waiting for IB-E or Haswell-E