Latest about Manufacturing
Huawei's AI chip capabilities still pale in comparison to American silicon
Premium A new report from the Council on Foreign Relations concludes that Huawei’s AI chip capabilities lag behind Nvidia’s by a wide margin, and that the gap is growing exponentially.
TSMC brings its most advanced chipmaking node to the US yet, to begin equipment installation for 3mn months ahead of schedule
Fab 21 phase 2 shell is complete, fab is on track for equipment move in in mid-2026 and for volume production in 2027.
Honda to temporarily shut down factories in China and Japan because of chip shortage
Honda announced the suspension of operations in five automotive manufacturing plants, citing the lack of legacy chips from Nexperia as the reason behind the move.
China may have reverse engineered EUV lithography tool in covert lab, report claims
Well, kind of.
New Texas Instruments fab will pump out tens of millions of chips per day
Texas Instruments has started producing 300mm wafers at its new Sherman, Texas mega-site, with the SM1 fab capable of outputting tens of millions of chips per day.
Sales of chip production equipment to reach $156 billion by 2027 due to AI and DRAM demand
Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.
Rapidus explores panel-level packaging on glass substrates for next-generation processors
Wedding glass and PLP ahead of others?
Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment
2D materials are getting closer to manufacturability using industry-standard equipment.
Intel installs industry's first commercial High-NA EUV lithography tool
Sets the stage for 14A process technology.
New 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes
Premium Japan’s Dai Nippon Printing (DNP) claims to have developed a nanoimprint lithography template capable of patterning logic with a feature size of 1.4nm, with plans for mass production in 2027.