Samsung reportedly plans to join UALink Alliance — high-speed interconnect could power its next-gen chips

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Samsung has expressed interest in joining the UALink Alliance, which aims to create new interconnect standards for various accelerators, according to DigiTimes. The report suggests that the plan is designed to boost Samsung's foundry business, allowing it to better address its customers' needs. However, Samsung could also develop its own accelerators and connect them using industry standard technology. 

At the Samsung Foundry Forum (SFF) 2024, TaeJoong Song, who leads business development at Samsung's foundry division, indicated that Samsung is intrigued by UALink's efforts to standardize AI chip interconnectivity. He mentioned that Samsung is exploring ways to support and possibly join the alliance. 

The UALink initiative aims to establish an open standard for more efficient communication between AI accelerators by facilitating direct data transfers between the memory of attached accelerators, thus improving performance and efficiency for demanding compute workloads. The initial UALink specification, version 1.0, will support connecting up to 1,024 accelerators within an AI computing pod, creating a reliable, scalable, and low-latency network. The technology will, of course, challenge Nvidia's NVLink, which serves the same purpose. 

Despite being competitors in other areas, the companies in the UALink Alliance are collaborating to reduce their reliance on Nvidia's NVLink. This collective effort highlights their urgency in addressing Nvidia's monopolistic hold on AI chip interconnect technology.  

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Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.