The leading provider of solid-state micro-speaker technology, xMEMS Labs, has announced the first all-silicon active micro-cooling fan-on-a-chip for use with mobile devices. The innovative technology will allow manufacturers to integrate active cooling into their smartphones, tablets, and other advanced mobile devices without sacrificing size.
Since manufacturers are constantly trying to reduce the size of our mobile devices, space inside the case is always at a premium. On the other hand, thermal management is becoming more critical with the advent of running processor-intensive artificial intelligence (AI) apps on-device. Gaming and computational photography needs have also become very GPU-intensive, thus leading to even more heat.
Without a solution for active cooling in these devices, hardware and software designers face limitations in what they can allow smartphones and similar devices to do. With the xMEMS Labs’ new XMC-2400 micro-cooling chip, they have a potential solution.
The XMC-2400 measures 9.26mm by 7.6mm and is just 1.08mm thick. It weighs less than 150 milligrams but can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure. The fan is inaudible and draws no more than an estimated 30mW of power.
