CEA-Leti Creates 96-Core CPU from Six Chiplets With Active Interposer

(Image credit: CEA-Leti)
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At the ISSCC 2020 conference, French research institute CEA-Leti showed a 96-core processors created from six chiplets, connected via an active interposer.   

The work was shown this week at the IEEE Solid-State Circuits Conference (ISSCC) in San Francisco and reported on by IEEE Spectrum. CEA-Leti stacked six 16-core chiplets on an active interposer, which is a large piece of silicon that connects the individual chiplets. The active interposer contains voltage regulation circuits and a network-on-chip (NoC) for linking the on-chip SRAM memories together.

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