The 64-core Graviton2 processors comes with 30 billion transistors created on the 7nm process.
Intel, joined by Raja Koduri, on Monday opened a new design and engineering center in India. It will focus on data-centric computing and communication technology.
Intel is reportedly in 'advanced talks' to acquire Israeli AI start-up Habana Labs for between $1 and $2 billion, adding to its tally of AI acquisitions that includes Movidius and Nervana.
Intel has announced that the first corporate entities, Global 500 members, including GE, have joined its neuromorphic research community. They will build proof-of-concepts.
Intel has announced its next-gen Keem Bay VPU with 10x the deep learning inference performance. The company also provided some more details of its Nervana Neural Network Processors.
Samsung faced a manufacturing issue in a 200mm DRAM fab a few weeks ago caused by contaminated equipment with millions of dollars of damage, but says the problems are solved.
Intel today announced a monster FPGA with 43.3 billion transistors. The Stratix 10 GX 10M with 10 million logic elements is composed of two dies and four transceiver tiles all connected via EMIB.
TSMC plans to hire 8000 engineers for a new R&D center for 3nm process development. It is set to be located in northern Taiwan and will be completed in late 2020.
Intel has opened PTK1, which it claims is highly efficient and the smartest building in the world, with 14,000 sensors and a building management system using AI.
Intel says it wants to recapture its process lead after the plagued 10nm transition. It aims to return to a two-year process cadence, with 7nm in the fourth quarter of 2021.
TSMC has started construction of its 3nm fab. The $19.5 billion facility located in Taiwan is estimated to start production in 2023.
A GitHub commit to AMD's ROCm GPU software suggests AMD will support the BFloat16 numeric data format for deep learning.
The Intel graphics driver work for the Linux 5.5 kernel contains work on multi-GPU support, including handling integrated and discrete graphics concurrently.
The European ExaNoDe project has built a complete prototype of an advanced compute node that integrates FPGAs, HBM2 memory, and active interposers with 7nm Arm chiplets in a multi-chip module.
As part of its third quarter earnings, ASML reported it received a record 23 EUV system bookings, compared to seven deliveries and 10 bookings the previous quarter.
TSMC and Samsung have both announced advanced process nodes aimed at automotive applications such as ADAS and autonomous driving, for TSMC on 7nm and Samsung on 8nm.
Samsung Foundry, Arm and Synposys have collaborated to enable Arm's upcoming Hercules CPU IP on Samsung's 5LPE EUV process, using Synopsys' tools.
Intel has discontinued the Skylake-SP Xeon processors with integrated Omni-Path Architecture (OPA) fabric on-package. The news follows earlier comments by Intel that it has stopped OPA development.
TSMC claims it is delivering the first EUV chips to market with its N7+ process. It delivers a 15% increase in density compared to N7 and has reached similar yield levels.
A conspicuous tweet by Intel's chief architect Raja Koduri could point towards a June 2020 unveil or release date for its Xe graphics cards.
Intel Chief Data Scientist Melvin Greer was hired by the FBI to help with its hybrid cloud computing, as well as other FBI data management responsibilities.