Sunnyvale (CA) - OCZ today announced a new memory module that follows the recent trend of more visible cooling methods. The new "Reaper" modules come with a fin-array heatspreader that is connected to the main heatspreader of the module via a copper heatpipe.
According to the manufacturer, heat is dissipated through the "strategically-placed compact aluminum fin array," which promises to "minimize heat produced by high-speed memory." The Reaper memory is available in 2 GB kits as PC2-8500 (1066 MHz) models running at CL 5-5-5.
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