Heat Dissipation: All AMD CPUs Compared
Yield For The Thoroughbred "B": 306 CPUs Per Wafer
|CPU core||Thoroughbred "B"||Thoroughbred "A"||Palomino|
|Wafer size||31416 mm²||31416 mm²||31416 mm²|
|Die-size||84 mm²||80 mm²||128 mm²|
|Process||0,13 µm||0,13 µm||0,18 µm|
|Cut loss||18 Prozent||18 Prozent||18 Prozent|
|Yield||306 parts/Wafer||322 parts/Wafer||201 parts/Wafer|
AMD works exclusively with wafers with a diameter of 200 mm, which constitutes a total surface area of 31415 mm² of silicon. The quotient from wafer surface and CPU die size gives you the theoretical yield, without waste. In the production process, an average of 18% clippings results from the 200 mm wafers.
With the production of the Thoroughbred core in Dresden, AMD calculates a yield of approximately 306 CPUs - based on 0.13 micron technology and a die surface of 84 mm². Compared to its predecessor, the Thoroughbred "A," the theoretical yield decreases to 16 pieces per wafer. Note that the count of 306 processors assumes an error of 0%.