Heat Dissipation: All AMD CPUs Compared
Yield For The Thoroughbred "B": 306 CPUs Per Wafer
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| CPU core | Thoroughbred "B" | Thoroughbred "A" | Palomino |
| Wafer size | 31416 mm² | 31416 mm² | 31416 mm² |
| Die-size | 84 mm² | 80 mm² | 128 mm² |
| Process | 0,13 µm | 0,13 µm | 0,18 µm |
| Cut loss | 18 Prozent | 18 Prozent | 18 Prozent |
| Yield | 306 parts/Wafer | 322 parts/Wafer | 201 parts/Wafer |
AMD works exclusively with wafers with a diameter of 200 mm, which constitutes a total surface area of 31415 mm² of silicon. The quotient from wafer surface and CPU die size gives you the theoretical yield, without waste. In the production process, an average of 18% clippings results from the 200 mm wafers.
With the production of the Thoroughbred core in Dresden, AMD calculates a yield of approximately 306 CPUs - based on 0.13 micron technology and a die surface of 84 mm². Compared to its predecessor, the Thoroughbred "A," the theoretical yield decreases to 16 pieces per wafer. Note that the count of 306 processors assumes an error of 0%.
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