Dicing is the name for the process to cut the wafers into individual dies. At this point, the dies that failed the checks on the wafer probers were already marked, so the defective parts can be separated from the functional ones. Modern solutions do not necessarily mark the dies, but the dicing solution fetches a wafer map from a database.
Die Bonding
Bonding describes the application of a functional die onto a frame of a processor package using an adhesive material.
Wire bonding refers to creating the pin contacts between the package and the die. Gold, aluminum or copper can be used, and there is ball or wedge bonding.
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