IFS

EU seeks to double global chip production market share to 20% by 2030 with $47 billion subsidies to manufacturers.

The head of AMD would like to keep working with TSMC, but considers all options.

Intel introduces new process technology to address mobile, RF, IoT, consumer, storage and military, aerospace and government applications.

Intel reveals the benefits of backside power delivery networks and how it achieved it. This technology will be a major benefit for the upcoming 20A and 18A manufacturing nodes.

Intel to describe benefits of PowerVia backside PDN with 4nm-class test chip.

The EU reaches a deal on local semiconductor industry funding, to the tune of €43 billion.

Intel and Arm to cooperate on design technology co-optimization for Intel 18A node.

China's State Administration for Market Regulation still has not cleared Intel-Tower transaction.

Intel announced today that Stuart Pann will be the new head of its foundry business, and will attempt to accelerate its growth and rate of adoption by other customers.

As U.S.-based wafer fab equipment makers have to reduce headcount due to China business concerns, SIA addresses the U.S. government.