R&D

The National Science and Technology Council has published its five-year strategy to make the most of the CHIPS Act.

The Commerce Department is now accepting applications for up to three $100 million awards for semiconductor packaging R&D.

Chinese AI accelerator and CPU developers lose tens of millions of dollars in 2023.

The Department of Commerce is signaling that it intends to distribute at least $500 million of CHIPS Act cash.

Intel's CEO expects Magdeburg fab to be the most advanced fab in the world when it comes online.

Taiwan is set to subsidize semiconductor-related R&D as well as production CapEx.

U.S. Commerce Department set to survey companies in other sectors to find out how they procure simplistic, but vital chips.

In response to ongoing U.S.-China tensions, Kingston teams up with Longsys.

The U.S. government is planning to subsidizing the creation of advanced packaging facilities in America with a $3 billion allocation of CHIPS funding.

Chinese government subsidies boost domestic developers of EDA tools to increase their competitive positions.