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8GB DDR5 Contract Pricing Dropped 43% Through 2022
By Mark Tyson published
DDR5 contract prices dropped by 43% between Feb and October 2022, with little chance of recovery visible due to excess inventories and memory reliant device markets cooling.
Micron Delays EUV RAM to 2025, Lays Off 10% of Workforce
By Anton Shilov published
Micron kicks off sampling of 24Gb DDR5 ICs for enterprise market.

CHIPS Act Spurs $200 Billion Investments in U.S. Semi Industry
By Anton Shilov published
Over a dozen of new fabs being built in the U.S., nine fabs are expanding.
Intel Ireland Cost Cutting Drive: 2,000 Employees Offered Unpaid Leave
By Mark Tyson published
Approx 2,000 workers at the Intel Leixlip campus have been offered three months unpaid leave, say reports. If take-up is strong it might save the Irish business from the prospect of layoffs.

TSMC Founder Confirms Arizona 3nm Production Plans
By Mark Tyson published
TSMC Arizona phase one is ready for the 5nm "tool-in ceremony," and 3nm production will come via phase two of the fab’s development.
Apple To Replace China-Made NAND for Samsung: Report
By Mark Tyson published
Chinese NAND was only going to be used in Chinese iPhones, but due to sanction worries, Apple is allegedly going to use Samsung as an additional storage chip supplier instead.

Taiwan Expected to Reveal Its Own CHIPS Act on Thursday
By Mark Tyson published
The Taiwanese government has formulated an understandable reaction to the flight of semiconductor investments, with the "Industrial Innovation Act" set to provide 25% tax breaks on R&D.
Generative Design and 3D Metal Printing Enhance CPU Cooling Performance
By Mark Tyson published
The generative AI-powered heatsink design from Diabatix, copper 3D printed by Amnovis, looks strikingly different to traditional heatsinks, but is claimed to offer 22% better cooling.
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