Latest about Hot Chips
Premium Xe3P focuses on the most compute-intensive phases of AI inference.
Premium Nvidia has provided more color on its Vera CPU for agentic data centers at Hot Chips 2026, showcasing the benefits of spatial multithreading and the power benefits of the LPDDR5X memory system.
Premium Intel has pulled back the curtain on its next-gen Diamond Rapids Xeon CPUs, packing up to 256 P-cores and 1.28 TB of last-level cache.
Premium The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
Premium IBM is vastly expanding softwarte support on its mainframes with its first dual-ISA CPU core that natively supports z/Architecture and ARM instructions.
For a limited time, you’ll be able to read all of our latest reports from Hot Chips 2026 with a Tom’s Hardware account, no payment required.
Fabric8Labs has created a new 3D printing method that allows for printing copper cooling plates onto chips with extreme precision and intricate detail.
Huawei unveiled UB-Mesh at Hot Chips 2025 as an open protocol to unify AI datacenter interconnects, enabling million-processor SuperNodes with lower latency, cost, and higher reliability.
