Latest about Hot Chips
Hot Chips 2026: Nvidia breaks down 88-core Vera CPU
Premium Nvidia has provided more color on its Vera CPU for agentic data centers at Hot Chips 2026, showcasing the benefits of spatial multithreading and the power benefits of the LPDDR5X memory system.
Hot Chips 2026: Intel Xeon 7 'Diamond Rapids' comes with up to 256 P-cores, 1.28 GB of last-level cache
Premium Intel has pulled back the curtain on its next-gen Diamond Rapids Xeon CPUs, packing up to 256 P-cores and 1.28 TB of last-level cache.
Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling
Premium The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
Hot Chips 2026: IBM's first dual-ISA core natively executes ARM and z/Architecture in the same core; all cores run at 5.7 GHz base frequency
Premium IBM is vastly expanding softwarte support on its mainframes with its first dual-ISA CPU core that natively supports z/Architecture and ARM instructions.
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For a limited time, you’ll be able to read all of our latest reports from Hot Chips 2026 with a Tom’s Hardware account, no payment required.
Firm pioneers 3D printing copper coolers directly onto processors using OLED manufacturing techniques with 'pixel perfect accuracy'
Fabric8Labs has created a new 3D printing method that allows for printing copper cooling plates onto chips with extreme precision and intricate detail.
Huawei to open-source its UB-Mesh data center-scale interconnect soon, details technical aspects
Huawei unveiled UB-Mesh at Hot Chips 2025 as an open protocol to unify AI datacenter interconnects, enabling million-processor SuperNodes with lower latency, cost, and higher reliability.
Nvidia shares Blackwell Ultra's secrets — NVFP4 boost detailed and PCIe 6.0 support
News Analysis Nvidia offers an inside look at the ultra-efficient upcoming architecture
