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The E7525 is manufactured in 90 nm, contained within a flip-chip BGA-casing (ball grid array) and connected to the motherboard via 1077 balls. The integrated CPU interface now operates at a clockspeed of 200 MHz (FSB800), whereby slower clockspeeds such as 133 MHz (FSB533) are no longer supported. Consequently, an older Xeon Prestonia, although it is pin-compatible, cannot be operated on an E7525 system.
The two-channel memory interface is now capable of working with DDR2 400. Here a conservative path has been taken, as DDR2 533, as registered DRAM and ECC, is still not a Jedec Standard. Moreover, it is still possible to use DDR333 or DDR266, but non-registered DIMMs cannot be operated any more - this was still feasible with the previous chipset, E7505.