Intel Continues Ticking Backwards With New B365 Chipset

In September Intel released the H310C chipset, which was a downgrade of the existing 14nm H310 chipset back to the 22nm process node. As Intel continues its 14nm struggles, the Santa Clara chipmaker has launched the new B365 chipset. It's basically the B360 chipset purportedly produced under the 22nm manufacturing process and the Kaby Lake Platform Controller Hub (PCH).

Credit: IntelCredit: Intel
The latest B365 chipset measures 23 x 24mm. While Intel produces the H310C chipsets on its own 22nm process node, it's unknown whether Intel will also manufacture the B365 chipset or outsource it to a third-party foundry like TSMC. One thing's for sure, though. Unlike the other Intel 300-series chipsets that are based on the Coffee Lake PCH, the B365 chipset employs the Kaby Lake PCH instead. As a result, there are a few differences that separate the B365 chipset from the previous B360 chipset.


Intel B365 Chipset
Intel B360 Chipset
Code Name
Kaby LakeCoffee Lake
Bus Speed
8 GT/s DMI3
8 GT/s DMI3
TDP
6W6W
Supports Overclocking
No
No
Embedded Options Available
NoNo
# of DIMMs per channel
22
# of Displays Supported
33
PCI Support
NoNo
PCI Express Revision
3.03.0
PCI Express Configurations 
x1, x2, x4
x1, x2, x4
Max # of PCI Express Lanes
2012
# of USB Ports
1412
USB Revision
3.0/2.0
3.1/2.0
Max # of SATA 6.0 Gb/s Ports
66
RAID Configuration
PCIe 0,1,5 / SATA 0,1,5,10
No
Supported Processor PCI Express Port Configurations
1x16
1x16
Integrated Wireless
No Intel Wireless-AC MAC
Intel ME Firmware Version
1112

In terms of changes and improvements, the B365 chipset supports up to 20 PCIe lanes, whereas the B360 chipset maxes out at 12 PCIe lanes. The B365 chipset also brings two more USB ports and support for RAID configurations to the table. Nevertheless, the B360 chipset does have the upperhand in other departments. The B360 chipset comes with support for integrated wireless networking and USB 3.1, unlike the B365 chipset.

Since both chipsets are on the lower end of the spectrum, we expect that the upcoming B365 motherboards should perform equally as existing B360 motherboards already on the market or have such a small performance difference that the average user wouldn't notice. The party that could benefit the most out of the B365 launch is Intel, as it should allow the company to free up resources for 14nm production.

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  • lperreault21
    No wireless could be bad for a lot of people, and no usb 3.1 is disappointing
  • InvalidError
    Anonymous said:
    No wireless could be bad for a lot of people, and no usb 3.1 is disappointing

    I suspect tons of people don't care much or at all about wireless, I only use wireless for my tablets and laptops. As for "lack" of USB 3.1, keep in mind that the only difference between USB3.0 and USB3.1-gen1 is addition of the optional type-C connector to the spec, nothing a dumb A-to-C adapter can't circumvent. For most people buying B365 motherboards, giving up on gen2 isn't much of an issue since gen2 peripherals are still so few and far between. What they're most likely to use USB3.x for is thumb-drives and the vast majority of them still come nowhere close to maxing out gen1.

    Given how those features are still quite niche and people who absolutely want them can simply hunt down a B360 board instead, it is understandable that Intel couldn't be bothered to work them into an existing product retrofit.
  • logainofhades
    Anonymous said:
    No wireless could be bad for a lot of people, and no usb 3.1 is disappointing


    I have never seen a board that didn't use some kind of add in card, for wifi. Newer ones are M.2 variants, and earlier models were mini pci-e, similar to that found in laptops. This isn't going to affect many people.