Highspeed: FSB At 330 MHz, Memory At 285 MHz (DDR550)
An important aspect of overclocking is the ratio between the FSB and memory speeds. As revealed in our trials over the last few weeks, in synchronous operation (FSB and memory clocks are identical), the DDR550 memory now available can reach a maximum 285 MHz. Since we only had P4 processors with a fixed multiplier (multiplier lock), it was necessary to substantially raise the FSB speed to achieve a clock rate beyond the 5000 MHz mark. Current P4 CPUs run at a standard 200 MHz. In order to achieve a clock rate of 5 GHz, we needed an FSB speed of 294 MHz.
Note : A multiplier between 2.0 and 17.0 was allowed on the selected P4 CPU with the best features. That meant that from the outset synchronous operation of FSB and memory speed was not an option. Added to which, there are no memory modules on the market that permit this kind of clock rate. By adjusting the speed ratio to 3:2 (FSB to memory) we were able to operate the Corsair modules (DDR550) at 5255 MHz with 206 MHz.
The absolute limit : Corsair’s DDR550 memory at 285 MHz in CL3 mode
Scarce. We took it : DDR550 memory from Corsair.
1 GB of memory (DDR550) for extreme overclocking
Part of the preconditioning phase : FSB clock rate 330 MHz - and the system is stable !
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So would u have to cool it constantly? or.. wat?Reply
If they stopped cooling it the processor would die.Reply
Now, with that big of a heatsink how do you plan to close the tower? How do you plan to renew the liquid nitrogen without blowing up your PCReply
you will notice that this was done outside... so not very safe I bet. Also you would never be able to keep switching the system on and off as the ice would damage the pcReply
I couldn't help but think that there was a lot more they could have done to insulate the rest of the system from the CPU's immediate area .... I'm sure this system must have gone onto a crashing spree once all that ice built up and started short-circuiting all those electronics around the CPU's base .... for one example, they could have gone as far as to coating that area with silicone, i would think; or in the vary least, covering that area more to protect from the super cooled 'steam' flowing over the top of the copper tube and down onto the motherboard.Reply
Secondly, the over-use of thermal pastes ... from my understanding, application of thermal paste between a chip and a heatsink is supposed to be EXTREMELY THIN and evenly spread; any excess paste REDUCES thermal performance and just splotching it on can easily introduce air bubbles which would cause 'hot-spots' wherever a bubble lies.
If your going to draw attention to yourself by breaking some world records, it would be probably a good idea to do everything you can to make everything as perfect as can be ... for example, cleaning up the copper soldiering residues to 'good enough' levels isn't Good Enough!, go all the way and use scouring pads, polish and some attention to detail and people will respect you the more for your efforts and clean presentation. A key to success in life = Strive for excellence in whatever you do! Don't settle for second-best.
I know it's late, but you guys are clowns.Reply
They did it and then took it apart and threw it in a box. Sorry it won't fit in a case and it wasn't shiny enough for you nitpickers.
Let me know how cool yours is when you get done.
If you're going to post garbage then don't post at all.