Articles by Anton Shilov, Contributing Writer

Anton Shilov has been in the PC industry since 1990s playing games, building PCs, and writing stories about pretty much everything that relates to PCs, Macs, smartphones, tablets, and even fab equipment. Over his career, he has worked at a variety of high-ranking websites, including AnandTech, EE Times, TechRadar, X-bit Labs, and now Tom's Hardware. He is also a regular features contributor to Tom's Hardware Premium, writing about the latest developments in the semiconductor industry and related tech news and roadmaps. When Anton is not reading or writing about something high-tech, he is probably watching a good movie, playing a video game, or spending time with his family.

Articles by: Anton Shilov

Nvidia to demand full upfront payment for H200 GPUs from China customers, report claims — more than two million chips may have been ordered despite uncertain Beijing stance

By Anton Shilov published 8 January 26

Pays us, whether or not you are allowed to get your H200.

Micron to begin work on $100 billion New York 'megafab' imminently — landmark site to produce 40% of company's overall DRAM output in the U.S. by the 2040s

By Anton Shilov published 8 January 26

Premium After numerous delays, Micron is about to start building its $100 billion site in New York to produce 40% of its DRAM output in the U.S. in the 2040s.

Elon Musk wants to build a dirty 2nm chipmaking fab that you can smoke and eat cheeseburgers in — bets that Tesla will turn the concept of cleanrooms upside down

By Anton Shilov last updated 7 January 26

Elon Musk says that modern cleanrooms are built wrong, and if Tesla builds its own fab, he will be able to eat and smoke in that facility.

AMD unwraps Instinct MI500 boasting 1,000X more performance versus MI300X — setting the stage for the era of YottaFLOPS data centers

By Anton Shilov published 6 January 26

AMD announces CDNA 6-based Instinct MI500-series GPUs with HBM4E memory set to arrive in 2027 and offer 1000X higher performance compared to Instinct MI300X.

AMD touts Instinct MI430X, MI440X, and MI455X AI accelerators and Helios rack-scale AI architecture at CES — full MI400-series family fulfills a broad range of infrastructure and customer requirements

By Anton Shilov published 6 January 26

AMD reveals additional details about its strategy for AI and HPC deployments this year with EPYC 'Venice' and 'Venice-X' CPUs as well as Instinct MI430X, MI440X, and MI455X accelerators.

Finnish authorities seize ship and crew after undersea cable cut, pursuing criminal charges — Finnish special forces board ship, detain all 14 crewmembers

By Anton Shilov published 31 December 25

Cables and pipelines in the Gulf of Finland have been damaged four times in less than 1.5 years.

Nvidia's CUDA Tile examined: AI giant releases programming style for Rubin, Feynman, and beyond — tensor-native execution model lays the foundation for Blackwell and beyond

By Anton Shilov published 31 December 25

Premium Tensors FTW in Rubin, Feynman, and beyond.

Bitcoin on a Russian flag with a crack through it.

Russia cracks down on 'illegal' cryptomining with prison terms up to five years — Kremlin will begin prosecuting in 2027

By Anton Shilov published 30 December 25

The Russian government plans to penalize 'illegal' mining of cryptocurrency to prison terms of up to five years.

Start-up plans to use terahertz radio frequencies for communication between servers instead of copper or optical connections — radio-based interconnections offer 1.6 TB/s using half the volume of copper

By Anton Shilov last updated 30 December 25

When copper is not enough and yet optical interconnections are overkill, waveguide-based cables can do the job.

China tells chipmakers to use homegrown chipmaking tools for 50% of new capacity — decree designed to squeeze foreign suppliers out of supply chain

By Anton Shilov published 30 December 25

But there is a catch, or two.

TSMC begins quietly volume production of 2nm-class chips — first GAA transistor for TSMC claims up to 15% improvement at ISO power

By Anton Shilov published 29 December 25

As planned.

TSMC's average wafer prices increased by over 15% each year since 2019, report suggests — gross profit margins increase by 3.3x in 2025 alone, facing no real challengers

By Anton Shilov published 29 December 25

Premium TSMC hits a home run in the EUV era.

Louis Gerstner, the man who saved IBM, dies at 83 — industry mourns the passing of transformative CEO

By Anton Shilov published 28 December 25

The man who envisioned services as core business for high-tech companies leaves behind a tall legacy.

Intel displays tech to build extreme multi-chiplet packages 12 times the size of the largest AI processors, beating TSMC's biggest — floorplan the size of a cellphone, armed with HBM5, 14A compute tiles and 18A SRAM

By Anton Shilov published 26 December 25

Intel Foundry has released a video of a multi-chiplet 2.5D/3D processor with a 10,296 mm^2 silicon footprint, including leading-edge technologies such as 14A and 18A.

China's reverse-engineered Frankenstein EUV chipmaking tool hasn't produced a single chip — sanctions-busting experiment is still years away from becoming operational

By Anton Shilov published 24 December 25

Premium Recreating an entire supply chain is incredibly difficult

Intel's Fab 52 is bigger and better equipped than TSMC's Arizona facilities — Intel's production volume dwarfs TSMC's operations in the U.S.

By Anton Shilov last updated 23 December 25

Intel's Fab 52 in Arizona is currently the most advanced chip production facility in America, but it has yet to reach its full 40,000-wafer capacity due to low 18A yields.

AMD publishes first Zen 6 document detailing ground-up redesign on 2nm process node — brand-new 8-wide CPU core with strong vector capabilities

By Anton Shilov published 20 December 25

AMD's Zen 6-based CPUs may be number crunching monsters, given their core design that is partially revealed in a performance counters document.

Taiwan considers TSMC export ban that would prevent manufacturing its newest chip nodes in U.S. — limit exports to two generations behind leading-edge nodes, could slow down U.S. expansion

By Anton Shilov published 19 December 25

Taiwan's government is considering imposing N+2 export rule on TSMC's advanced process technologies, which would make it significantly harder for the foundry to develop overseas.

Intel-certified 256 GB DDR5 stick could cut Xeon memory power by 18%, saving millions of dollars — a 32W-per-socket reduction could save millions per hyperscale data center

By Anton Shilov published 19 December 25

SK hynix first to validate 32Gb-based 256GB DDR5 module with Intel: up to 32.4W power savings per server, or millions of dollars per hyperscale data center.

TSMC brings its most advanced chipmaking node to the US yet, to begin equipment installation for 3nm months ahead of schedule — Arizona fab slated for production in 2027

By Anton Shilov published 18 December 25

Fab 21 phase 2 shell is complete, fab is on track for equipment move in in mid-2026 and for volume production in 2027.

China may have reverse engineered EUV lithography tool in covert lab, report claims — employees given fake IDs to avoid secret project being detected, prototypes expected in 2028

By Anton Shilov published 18 December 25

Well, kind of.

Sales of chip production equipment to reach $156 billion by 2027 — China, Taiwan, and Korea lead intense demand

By Anton Shilov published 17 December 25

Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.

Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals

By Anton Shilov published 17 December 25

Wedding glass and PLP ahead of others?

Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment — chipmaker outlines 300-mm fab compatible with integration of 2D transistor contacts and gate stacks

By Anton Shilov published 17 December 25

2D materials are getting closer to manufacturability using industry-standard equipment.

Intel installs industry's first commercial High-NA EUV lithography tool — ASML Twinscan EXE:5200B sets the stage for 14A

By Anton Shilov published 17 December 25

Sets the stage for 14A process technology.

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