Latest RAM News
Samsung unveils 10.7Gbps LPDDR5X mobile memory optimized for AI applications
Samsung has announced its the next generation of LPDDR5X DRAM, capable of hitting 10.7Gbps of memory bandwidth.
SK hynix confirms it will bring next-gen HBM manufacturing to the US — $3.87 billion memory fab to be built in Indiana
SK hynix selects Indiana for its first HBM packaging fab in the USA.
Samsung puts 3D DRAM on the roadmap, stacked DRAM to follow
Samsung envisions vertical channel transistor, stacked DRAMs in the next 10 years.
Micron is building a new packaging and testing plant in China despite sales ban — largest American chipmaker expands abroad
Micron continues Chinese expansion despite sales ban in China.
SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana
Indiana chips and Indiana nights, starting in 2028.
Micron shows massive 256GB DDR5-8800 memory sticks — High-capacity double-height 20-watt MCRDIMM modules come in different flavors
Micron demonstrates 256 GB DDR5-8800 MCRDIMM modules for Intel's Granite Rapids processors.
Adata debuts heat-dissipating PCB coating with DDR5-8000+ memory, claims it boosts cooling performance by 10%
This coating will be used on Lancer Neon RGB and Lancer Neon RGB series DDR5 memory kits
Micron puts stackable 24GB HBM3E chips into volume production
Micron's HBM3E is coming into volume production, bringing the stackable 24GB chips capable of 1.2TB/s to the world.
