Samsung
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Samsung Galaxy Book 4 laptop will be available next week
By Mark Tyson published
Samsung's Galaxy Book 4 Ultra, Book 4 Pro, and Book 4 Pro 360 AI PCs will be available from Monday.
Arm and Samsung to co-optimize Cortex-A and Cortex-X cores for gate-all-around transistors
By Anton Shilov published
Arm and Samsung are working together to deliver optimized next-generation Arm Cortex-X and Cortex-A CPU cores on an MBCFET-based node, with gate-all-around transistors.
ASML's High-NA chipmaking tool will cost $380 million
By Anton Shilov published
AMSL's High-NA lithography machine to cost more than twice as much as existing Low-NA tools.
Samsung Magician Software updated after ‘high severity’ security vulnerability found
By Mark Tyson published
Samsung has issued an update to its Magician Software SSD tool after a 'high severity' vulnerability, allowing local users higher privilege file access, was found.
Evidence mounts that TSMC won't adopt next-gen EUV chipmaking tools until 1nm debuts in the 2030 timeframe
By Anton Shilov published
Fab toolmaker tells DigiTimes that TSMC will likely adopt High-NA at 1nm.
TSMC is now the world's largest semiconductor maker by revenue, beating Intel and Samsung: Analyst
By Anton Shilov published
TSMC earned more than Intel and Samsung in 2023, becoming the world's biggest chipmaker by revenue.
SK Hynix says new high bandwidth memory for GPUs on track for 2024 - HBM4 with 2048-bit interface and 1.5TB/s per stack is on the way
By Anton Shilov published
HBM4 memory with a 2048-bit interface on track for production in 2026.
Samsung's upcoming 280-layer QLC flash could allow for 16TB M.2 SSDs
By Aaron Klotz published
Samsung is getting ready to announce its next-generation QLC V9 NAND flash that will reportedly be nearly 50% denser than the competition, with potentially improved performance as well.
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