Intel LGA1851 Socket For Future Arrow Lake CPUs Detailed

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Prime Z790-P WiFi D4 (Image credit: Asus)

Intel is preparing its Arrow Lake processors to rival the best CPUs in 2024. Igor's Lab recently dropped a bomb on the hardware world, leaking the performance projections for Arrow Lake. Making good on its promise, the German news outlet has revealed information on the forthcoming LGA1851 socket that will house the new Arrow Lake parts.

The LGA1851 socket, as its name reveals, will sport 1,851 pins, 9% more than the current LGA1700 socket. Increasing pins will help improve the I/O interfaces and close the gap with AMD's AM5 socket. As a quick summary, the LGA1700 platform only provides a single PCIe 4.0 x4 interface for SSDs. The downside to this design is that PCIe 5.0 SSDs have to fight with graphics cards for the available PCIe lanes. Igor's Lab provided the schematics for the LGA1851 socket, showing the increase in the PCIe area to provide more bandwidth. The LGA1851 will reportedly arrive with a PCIe 5.0 x4 interface, finally bringing native support for PCIe 5.0 SSDs. Therefore, the primary PCIe x16 slot will be left alone.

Zhiye Liu
News Editor, RAM Reviewer & SSD Technician

Zhiye Liu is a news editor, memory reviewer, and SSD tester at Tom’s Hardware. Although he loves everything that’s hardware, he has a soft spot for CPUs, GPUs, and RAM.

  • bit_user
    From what I can tell, neither this nor the Igor's Lab article says what's happening to DMI (i.e. the chipset link). Currently, it's PCIe 4.0 x8. What's happening with its speed and width?
    Reply
  • usertests
    The maximum dynamic pressure for the LGA1815 socket has increased from 489.5N to 923N, an 89% increase. In layman's terms, it'll require more pressure from CPU coolers. You may be able to conserve your CPU cooler but will need a new mounting kit.
    What? Why?
    Reply
  • who_farted
    I am surprised we still have to deal with the fragility of pins. Why can't we just have a pad to pad connection?
    Reply
  • Dantte
    who_farted said:
    I am surprised we still have to deal with the fragility of pins. Why can't we just have a pad to pad connection?
    Pads dont have tolerances and must be on a perfectly level surface to make contact.

    Your question is like saying: "why cant we have heat sinks that dont require TIM?" You know why we have TIM, because the surfaces are not perfectly level and we need a (Thermal Interface) Material between them to fill in the gaps. The "pins" on a processor have tolerances and fill in those gaps between the socket and processor, some go a little deeper, some a little shallow, but they still make contact, pads cant do this.
    Reply
  • Friesiansam
    Whizzo! Another new socket, another new motherboard etc...

    On the other hand you could go AM5 and be able to upgrade the CPU in a few years, to the latest thing, without needing a new motherboard.
    Reply
  • InvalidError
    usertests said:
    What? Why?
    I'm guessing the doubling of mounting pressure is because the pin density increase is achieved using stubbier pins.

    Dantte said:
    Pads dont have tolerances and must be on a perfectly level surface to make contact.
    It doesn't have to be perfectly flat. Only flat enough that mounting pressure, compressibility and flex can take care of whatever gaps remains. Plate extra thickness on the pads and it should be fairly doable.
    Reply
  • gggplaya
    Alder Lake launched in November 2021 which was 20 months ago and Raptor lake launched 8 months ago. So 2 gens on a socket? Assuming Arrow lake comes out in q4 2024 or Meteor lake comes out sooner with LGA1851 or as Mobile only.

    I'll stick with AMD, I like what they did with AM4. It wasn't perfect, it was hard to foresee future feature updates added to new chipsets. But it was much better than this, where Intel changes the socket completely after only 2 gens. At least AMD attempted to make older x370 motherboard future compatible with fragmented bios updates.
    Reply
  • Amdlova
    Will come with the alluminium thing to not bending the socked...
    Will need the bender of Futurama
    Reply
  • InvalidError
    Friesiansam said:
    On the other hand you could go AM5 and be able to upgrade the CPU in a few years, to the latest thing, without needing a new motherboard.
    That is only relevant to maybe 2-3% of PC owners. Between laptops, SBCs and similar highly integrated solutions people use as x86 PCs, 80+% of PC owners have CPUs soldered to the motherboard.

    By the time I want to upgrade my i5-11400, I'll likely want new-everything just like every other time I have upgraded.
    gggplaya said:
    Alder Lake launched in November 2021 which was 20 months ago and Raptor lake launched 8 months ago. So 2 gens on a socket? Assuming Arrow lake comes out in q4 2024 or Meteor lake comes out sooner with LGA1851 or as Mobile only.
    Intel has been doing two CPU generations per socket for the last ~25 years apart for one or two cases where there was only one, nothing new there.
    Reply
  • cyrusfox
    The only questions I have that are still unclear,
    •Mounting, will it be cross compatible with LGA1700?
    •PCIE cpu lanes and DMI, Any different from 700 series?
    •DLVR?
    Reply