Semiconductors
Latest about Semiconductors

TSMC to open up chip design center in Munich to help local chip developers
By Anton Shilov published
TSMC will open its first European chip design center in Munich to support European developers with design technology co-optimization for both mature and advanced nodes.

AI chip boom sparks BT substrate materials shortage
By Dallin Grimm published
TSMC's demand for CoWoS material has cascaded to impact suppliers of BT substrate base materials, causing the memory market to react quickly to avoid shortages and other negative effects.

Report claims Washington measures could be bolstering China's chip market
By Stephen Warwick published
A new report claims U.S. sanctions could be fuelling more resilience in China's semiconductor ecosystem.

"Export control was a failure." Nvidia CEO Jensen Huang slams Biden's China AI restrictions - Computex 2025 Q and A
By Sayem Ahmed published
Premium Nvidia's CEO Jensen Huang addressed trade and new AI technologies in a Computex Q&A

Suspected SK hynix HBM tech leaker arrested boarding flight to China
By Mark Tyson published
A man suspected of attempting to smuggle SK hynix tech secrets to China was apprehended at South Korea’s Incheon International Airport earlier this month

TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
By Anton Shilov published
TSMC plans to build or ramp up nine new production facilities in 2025 — the highest in its history — as it accelerates global expansion to meet demand and rising manufacturing complexity.

GlobalWafers to invest a further $4 billion into U.S. chip manufacturing
By Ash Hill published
Taiwanese manufacturer GlobalWafers is planning to invest $4 billion more into US-based chip manufacturing after opening a new facility in Sherman, Texas.

Intel says foundry business won't break even until 14A in 2027
By Anton Shilov published
Intel expects its loss-making Foundry division to reach breakeven by 2027, driven by internal adoption of its 18A process, and contributions from packaging, and mature nodes.
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