Semiconductors

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Intel to co-develop and manufacture Fortinet's next-gen firewall ASIC

By Luke James Published

SP6 will draw on what the companies described as Intel's expertise in disaggregated semiconductor design and advanced packaging.

Semiconductors
TSMC eyes price hikes of up to 25% on chip production services in 2027, report claims

By Anton Shilov Published

TSMC reportedly intends to increase prices of wafers it processes citing demand, rising costs, and increased investments in new capacity.

Semiconductors
SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV

By Anton Shilov Published

SMIC's N+3 process technology can achieve transistor density comparable to TSMC's N6 without using EUV lithography, but it fails to deliver performance or efficiency of modern production nodes.

Semiconductors
ASML's planned Low-NA EUV machine price hikes reportedly anger TSMC

By Anton Shilov Published

Premium Low-NA, high stakes

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TSMC confirms significant yield and performance improvements in A14 update

By Anton Shilov Published

TSMC's A14 process technology progresses faster than N2 at this stage of development as developers of both client and AI/HPC plan to use it.

Semiconductors
ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements

By Anton Shilov Published

ASML's comments point to intentions to increase prices, though the company is expected to maintain its value-based approach to price setting. Yet, TSMC is reportedly unhappy about the potential plan.

Semiconductors
Tower Semiconductor revives shuttered Panasonic-era fab in $3 billion Japan photonics expansion — METI-backed plan targets $3.6 billion revenue by 2028

By Luke James Published

Premium Tower Semiconductor has announced a dual-track expansion of its 300mm silicon photonics, silicon germanium, and advanced packaging operations in Japan

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Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV

By Etiido Uko Published

Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production

Semiconductors
Intel's EMIB packaging gains traction as chip designers look beyond TSMC's constrained CoWoS

By Anton Shilov Published

Premium Google has reportedly chosen Intel's EMIB-T over TSMC's CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?

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Micron commits $500 million to GlobalWafers' Texas wafer plant as it raises U.S. spending to $250 billion

By Luke James Published

Premium Running until 2035, the $250 billion spending target is attached to a goal of making 40% of Micron's DRAM in the U.S. by the mid-2030s.

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