Semiconductors

Intel's enhanced 18A-P has entered risk production, laying the groundwork to ramp the node into full production in the coming months.

SemiAnalysis has published the first teardown from its new in-house lab, focusing on the minimum local metal pitch on SMIC’s third-gen 7nm at 32.5nm.

CoPoS may enable larger chips, but CoWoS is still better.

Chinese startup Prinano claims it produced 8-inch photonic chip wafers without DUV lithography, using nanoimprint technology that cuts costs by 90%.

All this demand for AI chips is just too much for one company.

Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.

Thousands of SK hynix employees fled their factory stations earlier today as a fire broke out in a room where fluorine gas was used.

TikTok owner Bytedance reportedly developing its own custom CPUs in a bid to reduce costs and dependence from US chipmakers