Noiseless Computing: New Case Innovation From Zalman

Totally No Noise Computing With The TNN 500A, Continued

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Specifications For The TNN 500A
Number Of Internal 3.5" Bays4
Number Of External 3.5" Bays1
Number Of External 5.25" Bays2
Number Of Case Fans SupportedNone - TNN 500A uses an innovative convection cooling systems to move heat to the outside of the case.
Construction MaterialAluminum from 5mm to 7mm thickness
Power Supply Details300 Watt - No Fan PSU included
Special FeaturesNo Fan Design, 2 Front Mounted USB 2.0 ports behind front door
Size22.5("H") x 11.25("W") x 15.75("D")
Sample Case Provided
Estimated CostLess Than $1400.00 US - Final Pricing Not Set
Cooling Potential Rating8
Construction Quality Rating9
Overall Case Rating8

The philosophy behind this cooling approach is simple: Zalman employs cooling blocks/heatsinks that are connected to heat pipes; these pipes move the heat from the inside of the case to the outside of the chassis's heat sink panels using contact blocks attached to the inside panels of the chassis. For example, the CPU Heatsink inside the TNN 500A uses six 6mm heat pipes to move the heat from the CPU to the outside of the chassis for heat dissipation. Zalman claims that in the CPU cooler, for example, using the six 6 mm heat pipes can combine effectively 100 Watts of heat, affording ample cooling for the hottest CPUs. By way of comparison, the heat transfer rate of an Intel 3.06 GHz chip is about 83 Watts. Following Zalman's principles of heat dissipation, this should provide for ample cooling without problems.

A closer look at how the heat pipes attach to the case.

In addition to the CPU heat pipe cooling methodology, Zalman also offers a heat pipe cooling transfer system using two 6 mm heat pipes that should provide ample cooling for the highest performance video cards. These two heat pipes for the VGA cooler combine 50 Watts cooling capable of handling the hottest GPUs. Besides the VGA and CPU heat pipe coolers, Zalman introduces and provides a no-fan power supply that also utilizes a heat source contact method developed by Zalman for power supply heat dissipation to the outside of the chassis.