Thermaltake Tide Water Tackles GPU Heat

Grist For The Graphics Mill By Thermaltake

Metals such as copper or aluminum are best suited for being the primary conductor, which is why they are used for heat sinks. The larger the total heat sink surface, the better the thermal absorption. Even so, a fan is required to exchange the surrounding air quickly enough to dissipate heat effectively.

As a follow-up step, manufacturers often add another heat conducting layer. A so-called waterblock is used as the interface between a silicon chip and the liquid coolant. The closer the coolant is placed to the hot spot, the better. Think of the whole cooling process as a cascaded solution: the waterblock heats up quickly, but dissipates its heat to the liquid coolant right away, which is why it is essential to maintain a steady flow. On the other side of the loop, the coolant will pass through a concave multi-fin heat sink called the radiator.

While most liquid cooling solutions involve multiple elements that the user has to install and put together, Thermaltake's approach consists of a single module. Let's see how well it works.

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Patrick Schmid
Editor-in-Chief (2005-2006)

Patrick Schmid was the editor-in-chief for Tom's Hardware from 2005 to 2006. He wrote numerous articles on a wide range of hardware topics, including storage, CPUs, and system builds.