Samsung Foundry to build 2nm processors with HBM for Japanese AI firm

Samsung Foundry
(Image credit: Samsung Foundry)

Samsung Electronics has announced a partnership with Japanese AI company Preferred Networks to supply advanced processors made on its 2nm-class process technology (which is presumably also known as SF3P) and packaged using its Interposer-Cube S 2.5D packaging technology. The processors are proprietary AI accelerators for datacenters that Preferred Networks will use for upcoming projects. 

The system-on-chip AI accelerator will be developed by Gaonchips, a South Korea-based contract designer of chips that partners with Arm, among others. Samsung does not disclose the specifications or target performance of the processors it will produce for Preferred Networks, but the usage of the Interposer-Cube S 2.5D packaging technology allows it to build multi-chiplet designs with HBM memory. In addition, the joint press release by the two companies implies that we might be dealing with a multi-chiplet project.  

Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.