Arne Verheyde

TSMC plans to hire 8000 engineers for a new R&D center for 3nm process development. It is set to be located in northern Taiwan and will be completed in late 2020.

Intel has opened PTK1, which it claims is highly efficient and the smartest building in the world, with 14,000 sensors and a building management system using AI.

Intel says it wants to recapture its process lead after the plagued 10nm transition. It aims to return to a two-year process cadence, with 7nm in the fourth quarter of 2021.

TSMC has started construction of its 3nm fab. The $19.5 billion facility located in Taiwan is estimated to start production in 2023.

A GitHub commit to AMD's ROCm GPU software suggests AMD will support the BFloat16 numeric data format for deep learning.

The Intel graphics driver work for the Linux 5.5 kernel contains work on multi-GPU support, including handling integrated and discrete graphics concurrently.

The European ExaNoDe project has built a complete prototype of an advanced compute node that integrates FPGAs, HBM2 memory, and active interposers with 7nm Arm chiplets in a multi-chip module.

As part of its third quarter earnings, ASML reported it received a record 23 EUV system bookings, compared to seven deliveries and 10 bookings the previous quarter.

TSMC and Samsung have both announced advanced process nodes aimed at automotive applications such as ADAS and autonomous driving, for TSMC on 7nm and Samsung on 8nm.

Intel refutes rumors that it is skipping the 10nm process for desktop processors

Intel is bringing 2.5GbE and Wi-Fi 6 to the desktop.

Samsung Foundry, Arm and Synposys have collaborated to enable Arm's upcoming Hercules CPU IP on Samsung's 5LPE EUV process, using Synopsys' tools.

Intel has discontinued the Skylake-SP Xeon processors with integrated Omni-Path Architecture (OPA) fabric on-package. The news follows earlier comments by Intel that it has stopped OPA development.

TSMC claims it is delivering the first EUV chips to market with its N7+ process. It delivers a 15% increase in density compared to N7 and has reached similar yield levels.

A conspicuous tweet by Intel's chief architect Raja Koduri could point towards a June 2020 unveil or release date for its Xe graphics cards.

Intel Chief Data Scientist Melvin Greer was hired by the FBI to help with its hybrid cloud computing, as well as other FBI data management responsibilities.

Microsoft has announced that it has developed a custom SQ1 processor in partnership with Qualcomm, as part of the Surface Pro X. It has a 2TFLOPS GPU and a 9TOPS AI engine.

Researchers from Purdue University have demonstrated for the first time probabilistic computing hardware, factorizing 945 by using eight probabilistic bits or p-bits.

Intel drops the pricing bomb with the release of its 10th-gen Cascade Lake-X chips.

Oracle invested $40 million in Arm server chipmaker Ampere in April this year and also bought hardware for development and testing purposes.

Two Intel vice presidents have left the company. The departures concern the VP of Client Architecture and Innovation and the VP of System Software Products.

TSMC and Arm have announced the industry's first 7nm chiplet system with a CoWoS interposer for HPC. It has four 4GHz Cortex-A72 cores per chiplet and uses the new LIPINCON interconnect.

GlobalFoundries' 12LP+ process will see volume production in 2021. It's supposed to provide a 20% increase in performance or a 40% reduction in power.

A new roadmap provided by Aspeed shows that Sapphire Rapids is scheduled for an early 2021 launch despite a recent Ice Lake-SP delay to the second half of 2020.