News-analysis archive
January 2026
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23 articles
- January 23
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- Intel Q4 earnings reveal rocky path to recovery following weakest full-year revenue since 2010 — Intel Foundry losses continue as 18A begins ramp, but supply challenges set to ease in Q2 2026
- Alibaba plans IPO for chip-arm T-Head to help bankroll ambitious AI infrastructure investments — company to go up against Cambricon and Huawei to capture domestic accelerator market
- January 21
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- Chinese semiconductor industry gears up for domestic HBM3 production by the end of 2026 — CXMT to produce chips, while Naura, Maxwell, and U-Preseason design tools for assembly
- OpenAI shows clear compute and revenue scaling to soothe investor worries as company preps for IPO — expenditure continues to outweigh income as 10GW buildout continues
- January 20
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- U.S company Noveon Magnetics raises $215 million to expand homegrown rare earth magnet supply — $630 million spent in 2025 on American reshoring efforts to divest from Chinese reliance
- Micron acquires PSMC fab site in Taiwan for $1.8 billion, acquisition to expand the memory maker's operations within the region — move marks the end of the technology-for-capacity era
- January 19
- January 16
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- Microsoft built a ‘Community-First AI Infrastructure’ framework for its data center projects — new policy may be the blueprint for U.S hyperscalers to follow
- Glass cloth could be the next great AI shortage, as major manufacturers scramble to secure critical material — Japanese manufacturer courted by Apple, Nvidia, Google, and Amazon
- January 15
- January 14
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- SK hynix to spend $13 billion on the world's largest HBM memory assembly plant amid the worst shortage on record — South Korea facility to handle packaging and testing for AI memory campus
- AI chip design is pushing advanced chip packaging to its limits – workarounds exist for limits of 2.5D packaging, but are years away from viability
- January 13
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- Qwen boss says Chinese AI models have 'less than 20%' chance of leapfrogging Western counterparts — despite China's $1 billion AI IPO week, capital can't close the gap alone
- Deepseek research touts memory breakthrough, decoupling compute power and RAM pools to bypass GPU & HBM constraints — Engram conditional memory module commits static knowledge to system RAM
- January 9
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- Chinese researchers hail breakthrough in DRAM-like cells, which could be used in embedded or 3D stacked memory — absence of manufacturing detail casts doubt on mass production
- Nvidia refutes reports of HBM4 mass production delay, production 'on track' for the second half of 2025 — report suggested timeline shift to late Q126 due to revised spec
- January 8
- January 7
- January 6
- January 5
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- China’s top chip foundries move to consolidate as Beijing pushes semiconductor self-sufficiency — SMIC and Hua Hong Semiconductor deals pave the path to unified power
- U.S. electricity grid stretches thin as data centers rush to turn on onsite generators — Meta, xAI, and other tech giants race to solve AI's insatiable power appetite
- January 2