Micron
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DDR4 production is expected to continue until 2026
By Anton Shilov published
Premium Major DRAM makers are phasing out DDR4 production from late 2025, as they shift to DDR5, but supply will remain available for niche applications for years to come.

Inside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov published
Premium The 3D NAND industry is rapidly advancing toward 500-layer stacks and 4800 MT/s interfaces by 2027, enabling denser, faster, and more efficient storage.

HBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov published
Premium We've compiled a full roadmap of HBM memory for SK hynix, Micron, and Samsung, including HBM3, HBM3E, HBM4, and HBM4E.

Micron's industry-first PCI 6.0 SSD promises sequential reads up to 28,000 MB/s
By Anton Shilov published
Micron launched the 9650 SSD with PCIe 6.0 and 5.5M IOPS for AI workloads, and unveiled the 6600 ION series with up to 245TB for high-density, energy-efficient storage.

China's CXMT reportedly delays mass production of DDR5 chips to late 2025
By Anton Shilov published
Quality is on par with Nanya, but yields are around 50%.

DRAM prices are about to skyrocket — DDR4 and GDDR6 among formats that could increase in price by up to 45%
By Anton Shilov published
And that's without new tariffs on products from Japan and South Korea.

U.S. imposes 25% tariffs on all products from Japan and South Korea
By Anton Shilov published
They'll take effect from August 1

Micron details new U.S. fab projects — HBM production coming to America
By Anton Shilov published
Micron detailed its $200 billion U.S. investment plan to build six DRAM fabs and HBM assembly facilities in the U.S. over the next 20 years.
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