Micron
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HBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov published
Premium We've compiled a full roadmap of HBM memory for SK hynix, Micron, and Samsung, including HBM3, HBM3E, HBM4, and HBM4E.

Inside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov published
Premium The 3D NAND industry is rapidly advancing toward 500-layer stacks and 4800 MT/s interfaces by 2027, enabling denser, faster, and more efficient storage.

Micron's industry-first PCI 6.0 SSD promises sequential reads up to 28,000 MB/s
By Anton Shilov published
Micron launched the 9650 SSD with PCIe 6.0 and 5.5M IOPS for AI workloads, and unveiled the 6600 ION series with up to 245TB for high-density, energy-efficient storage.

China's CXMT reportedly delays mass production of DDR5 chips to late 2025
By Anton Shilov published
Quality is on par with Nanya, but yields are around 50%.

DRAM prices are about to skyrocket — DDR4 and GDDR6 among formats that could increase in price by up to 45%
By Anton Shilov published
And that's without new tariffs on products from Japan and South Korea.

U.S. imposes 25% tariffs on all products from Japan and South Korea
By Anton Shilov published
They'll take effect from August 1

Micron details new U.S. fab projects — HBM production coming to America
By Anton Shilov published
News Analysis Micron detailed its $200 billion U.S. investment plan to build six DRAM fabs and HBM assembly facilities in the U.S. over the next 20 years.

Micron samples ground-breaking EUV-based memory
By Anton Shilov published
And also a 30% increase in density
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